Huawei
Huawei Mate 70 is innovative from head to toe including chips: 360 Group Founder
Huawei Mate 70 is innovative from head to toe including its powerful core chips. That says the Founder of 360 Group – Zhou Hongyi. He added a few more words on how he sees the upcoming flagship lineup in the Chinese smartphone market.
Zhou Hongyi often shares his thoughts on upcoming products and devices, especially when it’s from Huawei. He released a video on Mate XT a couple of months ago. According to him, the tri-fold handset is steps ahead of the iPhone 16 in innovation.
Now the 360 Group Founder released another video footage saying that the Huawei Mate 70 is innovative from head to toe including software, chips, and cloud tech.
The executive says the flagship lineup packs self-developed core chips and an operating system. Most of the components in the Mate 70 series are 100% true and China-made. Huawei has taken the help of native suppliers to build a powerful lineup.
Zhou adds that the new Kirin chip for Mate 70 smartphones reflects the highest level of domestic mobile phone chips. Even though Huawei hasn’t talked about this matter yet. But many rumors claim that the new devices will have a robust chipset.
Zhou further says that the Mate 70 models run on Huawei Cloud services and stand on Pangu’s big AI model. These components make Mate 70 the strongest!
“…in addition to Huawei Cloud (an independent cloud service) and Huawei’s own Pangu big model, the true core of the Mate 70 series, the ‘strongest in history’, is the world’s first fully self-developed complete software, hardware, and cloud core.” – Zhou Hongyi.
The words simply reflect Huawei’s hard work, innovation, and efforts in research and development. Over time, the Chinese phone maker worked hard to achieve remarkable outcomes in chip tech and software. And seems the hard work pays off!
Mate 70 series self-developed (China-made) components also imply the company’s self-sufficiency. It breaks the dependency on foreign techs and elements while creating a new path in the chip field and innovation.
(source)